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應用案例

行業概述

機器視覺在半導體行業的應用已非常普遍,應用范圍也越來越廣,涉及到半導體外觀缺陷、尺寸大小、數量、平整度、間隔、定位、校準、焊點質量、彎曲度等等的檢測和測量。

檢測內容包括:

電子元器件外觀檢測、SMD產品的外觀檢測、硅片外觀檢測、IC芯片、電子鏈接器平整度檢測等。

打光難點:

產品形式多樣、檢測精度高、由于材料與工藝等原因產品本身特征不太明顯,因此對打光的要求比較高。 

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